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CUI Devices

CUI Devices

CUI Devices is an electronic components manufacturer specializing in an ever-expanding range of product technologies. Formerly part of CUI Inc, you can trace our roots back to 1989 just outside of Portland, Oregon. In September of 2019, a group of senior managers deeply involved in the historical growth of CUI Inc—and with over 15 years of average tenure—spun-off part of the business. Thus, CUI Devices was born, offering a wide range of Interconnect, Audio, Thermal Management, Motion, and Sensor solutions.
Datasheet Image Part Number Manufactures Stock Description View
HSS-B20-NPS-01 HSS-B20-NPS-01 HSS-B20-NPS-01 CUI Devices HEATSINK TO-220 4.2W ALUMINUM
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HSS-B20-095H HSS-B20-095H HSS-B20-095H CUI Devices HEATSINK TO-220 4.1W ALUMINUM
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HSS-B20-0508H-01S HSS-B20-0508H-01S HSS-B20-0508H-01S CUI Devices HEATSINK TO-220 4.7W ALUMINUM
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HSS-B20-NP-15 HSS-B20-NP-15 HSS-B20-NP-15 CUI Devices HEATSINK TO-220 4.1W ALUMINUM
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HSS-B20-NP HSS-B20-NP HSS-B20-NP CUI Devices HEATSINK TO-220 4W ALUMINUM
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HSE-B20250-045H HSE-B20250-045H HSE-B20250-045H CUI Devices HEAT SINK, EXTRUSION, TO-220, 50
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HSE-B18254-035H HSE-B18254-035H HSE-B18254-035H CUI Devices HEAT SINK, EXTRUSION, TO-218, 25
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HSS-B20-0635H-01 HSS-B20-0635H-01 HSS-B20-0635H-01 CUI Devices HEATSINK TO-220 2.7W ALUMINUM
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HSE-B2111-038 HSE-B2111-038 HSE-B2111-038 CUI Devices HEAT SINK, EXTRUSION, TO-220, 25
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HSS-B20-NP-12 HSS-B20-NP-12 HSS-B20-NP-12 CUI Devices HEATSINK TO-220 6.8W ALUMINUM
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HSB03-141406 HSB03-141406 HSB03-141406 CUI Devices HEAT SINK, BGA, 14 X 14 X 6 MM
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HSB12-272706 HSB12-272706 HSB12-272706 CUI Devices HEAT SINK, BGA, 27 X 27 X 6 MM
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HSB06-181810 HSB06-181810 HSB06-181810 CUI Devices HEAT SINK, BGA, 18 X 18 X 10 MM
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HSB18-232310 HSB18-232310 HSB18-232310 CUI Devices HEAT SINK, BGA, 23 X 23 X 10 MM
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HSE-B250-04H HSE-B250-04H HSE-B250-04H CUI Devices HEAT SINK, EXTRUSION, TO-220, 25
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HSB13-303014 HSB13-303014 HSB13-303014 CUI Devices HEAT SINK, BGA, 30.7 X 30.7 X 14
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HSS-C2540-SMT-TR HSS-C2540-SMT-TR HSS-C2540-SMT-TR CUI Devices HEAT SINK TO-263 COPPER
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HSB02-101007 HSB02-101007 HSB02-101007 CUI Devices HEAT SINK, BGA, 10 X 10 X 7 MM
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HSS-B20-CP-01 HSS-B20-CP-01 HSS-B20-CP-01 CUI Devices HEATSINK TO-220 2.6W ALUMINUM
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HSE-B20250-040H-01 HSE-B20250-040H-01 HSE-B20250-040H-01 CUI Devices HEAT SINK, EXTRUSION, TO-220, 25
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